Glossary

The failure at the bond line between a substrate and an adhesive; when the adhesive separates entirely from the substrate.

Failure within the adhesive under a stress, resulting in a broken bond with all adhered surfaces still covered with adhesive.

The failure of the substrate material itself upon subjecting the bonded adherend surfaces to a stress.

The permanent structural change that occurs in a material that has been subjected to fluctuating stress and strain.

The tapering of the edge of a film of dried material either by the method of application, sanding, or rubbing the dried film, resulting in a gradual progression of the film thickness from little or no material at the edge to a normal coating at the center.

A particulate solid material added to a resin-curing agent system to change properties and/or to lower cost.

The thin, level application of an adhesive or coating to a surface. Thickness is not typically greater than 0.010 inch.

The property of a material or assembly to withstand fire or give protection from it. Classes are I, II, III or A, B, C with Class I or A being the most fire resistant

A chemical or preparation of chemicals used to reduce flammability or to retard the spread of a fire over a surface

Transluscent- circular areas of substrate that are exposed through the film of a coating.

Lifting of dried films from the substrate in flakes.

The time given for a coating to evaporate the low boiling solvents before baking or flocking.

The minimum temperature of a liquid at which the vapours given off are sufficient to form a flammable structure with air.

Matting agent added to coatings to reduce the gloss of the film.

A state of matter, usually synonymous with higher elongation or lower modulus.

An additive used to increase system flexibility.

The ability of a material to withstand failure due to bending.

The development of loosely coherent, pigment agglomerates in the liquid paint.

The separation of one or more of the pigments from others and their concentration in streaks on the surface of the film.

An additive used to destroy, retard or prevent the growth of fungi and spores.